التفاصيل البيبلوغرافية
| العنوان: |
Viscoelastic Modeling for Heterogeneous Fan-out Wafer Molding Process |
| المؤلفون: |
Yeh, Shu-Shen, Lin, P. Y., Lee, K. C., Yew, M. C., Yang, C. C., Wang, J. H., Hsu, C. K., Lai, P. C., Tseng, Dion, Cheng, S. K., Jeng, Shin-Puu |
| المصدر: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) Electronic Components and Technology Conference (ECTC), 2020 IEEE 70th. :1081-1086 Jun, 2020 |
| Relation: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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