دورية أكاديمية
Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application
| العنوان: | Measurement and Error Analysis of Cu Film Thickness With Ta Barrier Layer on Wafer for CMP Application |
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| المؤلفون: | Qu, Z., Wang, W., Li, X., Li, Q., Zheng, Y. |
| المصدر: | IEEE Transactions on Instrumentation and Measurement IEEE Trans. Instrum. Meas. Instrumentation and Measurement, IEEE Transactions on. 70:1-10 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 00189456 15579662 |
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| DOI: | 10.1109/TIM.2020.3017057 |