التفاصيل البيبلوغرافية
| العنوان: |
Experimental Verification of the Junction Temperature Distribution within Press Pack IGBTs |
| المؤلفون: |
Zhang, Yiming, Deng, Erping, Zhao, Zhibin, Chen, Jie, Fu, Shi, Cui, Xiang |
| المصدر: |
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) Power Semiconductor Devices and ICs (ISPSD), 2020 32nd International Symposium on. :360-363 Sep, 2020 |
| Relation: |
2020 32nd International Symposium on Power Semiconductor Devices and ICs (ISPSD) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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