مؤتمر
High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method
| العنوان: | High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method |
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| المؤلفون: | Deng, Hongtao, Jiang, Dong, Wang, Kai, Fei, Qingguo |
| المصدر: | 2020 IEEE 5th International Conference on Image, Vision and Computing (ICIVC) Image, Vision and Computing (ICIVC), 2020 IEEE 5th International Conference on. :188-192 Jul, 2020 |
| Relation: | 2020 IEEE 5th International Conference on Image, Vision and Computing (ICIVC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781538628928 9781728166612 |
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| DOI: | 10.1109/ICIVC50857.2020.9177479 |