مؤتمر
High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method
العنوان: | High Temperature Deformation Field Measurement Using 3D Digital Image Correlation Method |
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المؤلفون: | Deng, Hongtao, Jiang, Dong, Wang, Kai, Fei, Qingguo |
المصدر: | 2020 IEEE 5th International Conference on Image, Vision and Computing (ICIVC) Image, Vision and Computing (ICIVC), 2020 IEEE 5th International Conference on. :188-192 Jul, 2020 |
Relation: | 2020 IEEE 5th International Conference on Image, Vision and Computing (ICIVC) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781538628928 9781728166612 |
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DOI: | 10.1109/ICIVC50857.2020.9177479 |