مؤتمر
A Low-Cost and High-Throughput NoC-Aware Chip-to-Chip Interconnection
| العنوان: | A Low-Cost and High-Throughput NoC-Aware Chip-to-Chip Interconnection |
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| المؤلفون: | Liao, Wenkang, Guo, Yuhao, Xiao, Shanlin, Yu, Zhiyi |
| المصدر: | 2020 IEEE International Symposium on Circuits and Systems (ISCAS) Circuits and Systems (ISCAS), 2020 IEEE International Symposium on. :1-5 Oct, 2020 |
| Relation: | 2020 IEEE International Symposium on Circuits and Systems (ISCAS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728133201 |
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| تدمد: | 21581525 |
| DOI: | 10.1109/ISCAS45731.2020.9181269 |