دورية أكاديمية
Yield Assessment for Dynamic Etching Processes With Variance Change
| العنوان: | Yield Assessment for Dynamic Etching Processes With Variance Change |
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| المؤلفون: | Wu, C.H., Pearn, W.L. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 10(10):1745-1753 Oct, 2020 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2020.3022418 |