مؤتمر
Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick
| العنوان: | Development of Ultra-Thin Thermal Ground Plane with High Performance Electroplated Wick |
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| المؤلفون: | Hu, I., Huang, H.-H., Huang, P.-C., Yu, J.-C., Liao, C.-N., Shih, M.-K., Tamg, D., Hung, C.P. |
| المصدر: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :97-103 Jul, 2020 |
| Relation: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728197647 9781728197630 |
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| تدمد: | 25770799 |
| DOI: | 10.1109/ITherm45881.2020.9190513 |