مؤتمر
Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal
| العنوان: | Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal |
|---|---|
| المؤلفون: | Hazra, Sougata, Piazza, Alisha, Jung, Ki Wook, Asheghi, Mehdi, Gupta, Man Prakash, Jih, Edward, Degner, Mike, Goodson, Kenneth E. |
| المصدر: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :83-90 Jul, 2020 |
| Relation: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728197647 9781728197630 |
|---|---|
| تدمد: | 25770799 |
| DOI: | 10.1109/ITherm45881.2020.9190541 |