مؤتمر
Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal
العنوان: | Microfabrication Challenges for Silicon-based Large Area (>500 mm2) 3D-manifolded Embedded Microcooler Devices for High Heat Flux Removal |
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المؤلفون: | Hazra, Sougata, Piazza, Alisha, Jung, Ki Wook, Asheghi, Mehdi, Gupta, Man Prakash, Jih, Edward, Degner, Mike, Goodson, Kenneth E. |
المصدر: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2020 19th IEEE Intersociety Conference on. :83-90 Jul, 2020 |
Relation: | 2020 19th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728197647 9781728197630 |
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تدمد: | 25770799 |
DOI: | 10.1109/ITherm45881.2020.9190541 |