مؤتمر
The Typical Failure Analysis Of Ceramic Packaged Devices
العنوان: | The Typical Failure Analysis Of Ceramic Packaged Devices |
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المؤلفون: | Fang, Jianming, Chen, Xuanlong, Chen, Yuan |
المصدر: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-3 Aug, 2020 |
Relation: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
ردمك: | 9781728168265 |
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DOI: | 10.1109/ICEPT50128.2020.9201920 |