التفاصيل البيبلوغرافية
| العنوان: |
Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue |
| المؤلفون: |
Yang, Donghua, Zhai, Xiang, Zhang, Chunhong, Gan, Guisheng, Ran, Teng, Du, Fei, Fan, Tao |
| المصدر: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020 |
| Relation: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
