مؤتمر
Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue
العنوان: | Interfacial Reaction and Failure Mechanism of SAC/Co-P Solder Joint under Rapid Thermal Fatigue |
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المؤلفون: | Yang, Donghua, Zhai, Xiang, Zhang, Chunhong, Gan, Guisheng, Ran, Teng, Du, Fei, Fan, Tao |
المصدر: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020 |
Relation: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
قاعدة البيانات: | IEEE Xplore Digital Library |
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