مؤتمر
Research on thermal impact properties of single solder joint by RTC
| العنوان: | Research on thermal impact properties of single solder joint by RTC |
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| المؤلفون: | Chen, Jibing, He, Zhanwen, Li, Juying |
| المصدر: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020 |
| Relation: | 2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728168265 |
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| DOI: | 10.1109/ICEPT50128.2020.9202697 |