التفاصيل البيبلوغرافية
| العنوان: |
Design, Fabrication and Measurement of Micro-Bumps Array for RF Application |
| المؤلفون: |
Yang, Yuchi, Chen, Jing, Wang, Wei, Wang, Mengcheng, Ma, Shenglin, Hu, Liulin, He, Shuwei |
| المصدر: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-4 Aug, 2020 |
| Relation: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
