التفاصيل البيبلوغرافية
| العنوان: |
Study on Influencing Factors of Gold Wire Bonding Performance of Nickel-free Soft Gold Microwave PCB |
| المؤلفون: |
Zhou, Bo, He, Xiao, Zou, Yabing, Li, Xingxing, He, Guanghui |
| المصدر: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2020 21st International Conference on. :1-5 Aug, 2020 |
| Relation: |
2020 21st International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
