مؤتمر
LowK wafer dicing robustness considerations and laser grooving process selection
| العنوان: | LowK wafer dicing robustness considerations and laser grooving process selection |
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| المؤلفون: | Laurent, Patrick, Robin, Olivier, Bouillard, Boris |
| المصدر: | 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) Electronics System-Integration Technology Conference (ESTC), 2020 IEEE 8th. :1-5 Sep, 2020 |
| Relation: | 2020 IEEE 8th Electronics System-Integration Technology Conference (ESTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728162935 |
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| DOI: | 10.1109/ESTC48849.2020.9229792 |