دورية أكاديمية
1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration
| العنوان: | 1.6 Tbps Silicon Photonics Integrated Circuit and 800 Gbps Photonic Engine for Switch Co-Packaging Demonstration |
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| المؤلفون: | Fathololoumi, S., Hui, D., Jadhav, S., Chen, J., Nguyen, K., Sakib, M., Li, Z., Mahalingam, H., Amiralizadeh, S., Tang, N.N., Potluri, H., Montazeri, M., Frish, H., Defrees, R.A., Seibert, C., Krichevsky, A., Doylend, J.K., Heck, J., Venables, R., Dahal, A., Awujoola, A., Vardapetyan, A., Kaur, G., Cen, M., Kulkarni, V., Islam, S.S., Spreitzer, R.L., Garag, S., Alduino, A.C., Chiou, R., Kamyab, L., Gupta, S., Xie, B., Appleton, R.S., Hollingsworth, S., McCargar, S., Akulova, Y., Brown, K.M., Jones, R., Zhu, D., Liljeberg, T., Liao, L. |
| المصدر: | Journal of Lightwave Technology J. Lightwave Technol. Lightwave Technology, Journal of. 39(4):1155-1161 Feb, 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 07338724 15582213 |
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| DOI: | 10.1109/JLT.2020.3039218 |