التفاصيل البيبلوغرافية
| العنوان: |
Analysis of Underfill-Polymer Interfacial Adhesive Strength by Combined Experimental and Modeling Approaches |
| المؤلفون: |
Yeh, Shu-Shen, Lin, P. Y., Hsu, C. K., Lin, Y. S., Wang, J. H., Lai, P. C., Liao, L. L., Lee, T. Y., Chen, C. H., Yew, M. C., Cheng, S. K., Jeng, Shin-Puu |
| المصدر: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :1-4 Oct, 2020 |
| Relation: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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