التفاصيل البيبلوغرافية
| العنوان: |
Determination of Biaxial Bending Strength of Thin Silicon Dies by the PoEF Test |
| المؤلفون: |
Tsai, M. Y., Yeh, J. H., Huang, P. S., Wang, Y. W., Chen, D. L., Shih, M. K., Tarng, David |
| المصدر: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :290-293 Oct, 2020 |
| Relation: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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