التفاصيل البيبلوغرافية
العنوان: |
Reliability of Instant Bonding of Cu-Cu joints: Thermal Cycling and Electromigration Tests |
المؤلفون: |
Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, King-Ning, Chen, Chih |
المصدر: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :91-94 Oct, 2020 |
Relation: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: |
IEEE Xplore Digital Library |