Reliability of Instant Bonding of Cu-Cu joints: Thermal Cycling and Electromigration Tests

التفاصيل البيبلوغرافية
العنوان:	Reliability of Instant Bonding of Cu-Cu joints: Thermal Cycling and Electromigration Tests
المؤلفون:	Shie, Kai-Cheng, Hsu, Po-Ning, Li, Yu-Jin, Tu, King-Ning, Chen, Chih
المصدر:	2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :91-94 Oct, 2020
Relation:	2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
قاعدة البيانات:	IEEE Xplore Digital Library