Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration

التفاصيل البيبلوغرافية
العنوان:	Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration
المؤلفون:	Ou-Yang, T. Y., Chang, H. H., Hsu, C. K., Fu, H. C., Liao, Y. S.
المصدر:	2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :32-35 Oct, 2020
Relation:	2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
قاعدة البيانات:	IEEE Xplore Digital Library