التفاصيل البيبلوغرافية
العنوان: |
Evaluation of Laser Releasable Temporary Bonding Adhesives for the Thinned Wafer Integration |
المؤلفون: |
Ou-Yang, T. Y., Chang, H. H., Hsu, C. K., Fu, H. C., Liao, Y. S. |
المصدر: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2020 15th International. :32-35 Oct, 2020 |
Relation: |
2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) |
قاعدة البيانات: |
IEEE Xplore Digital Library |