مؤتمر
Improvements and alternatives for ultra fine pitch encapsulation
| العنوان: | Improvements and alternatives for ultra fine pitch encapsulation |
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| المؤلفون: | Paquet, M.-C., Tremblay, A., Ouimet, S., Tetreault, R., Toutant, R. |
| المصدر: | 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :203-209 2001 |
| Relation: | 51st Electronic Components and Technology Conference 2001. Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780370384 9780780370388 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2001.927719 |