مؤتمر
Development of advanced 3D chip stacking technology with ultra-fine interconnection
| العنوان: | Development of advanced 3D chip stacking technology with ultra-fine interconnection |
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| المؤلفون: | Takahashi, K., Hoshino, M., Yonemura, H., Tomisaka, M., Sunohara, M., Tanioka, M., Sato, T., Kojima, K., Terao, H. |
| المصدر: | 2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Electronic components and technology Electronic Components and Technology Conference, 2001. Proceedings., 51st. :541-546 2001 |
| Relation: | 51st Electronic Components and Technology Conference 2001. Proceedings |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780370384 9780780370388 |
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| تدمد: | 05695503 |
| DOI: | 10.1109/ECTC.2001.927780 |