Wet or plasma clean? Competing or complementary? A dual damascene study with Si-OC-H dielectric on copper wiring

التفاصيل البيبلوغرافية
العنوان: Wet or plasma clean? Competing or complementary? A dual damascene study with Si-OC-H dielectric on copper wiring
المؤلفون: Louis, D., Assous, M., Blanc, R., Brun, P., Arvet, C., Lajoinie, E., Holmes, D.
المصدر: Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) Interconnect technology conference Interconnect Technology Conference, 2001. Proceedings of the IEEE 2001 International. :289-291 2001
Relation: Proceedings of the IEEE 2001 International Interconnect Technology Conference
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:0780366786
9780780366787
DOI:10.1109/IITC.2001.930086