مؤتمر
Heuristic Approach for Identification of Random TSV Defects in 3D IC During Pre-bond Testing
| العنوان: | Heuristic Approach for Identification of Random TSV Defects in 3D IC During Pre-bond Testing |
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| المؤلفون: | Kaibartta, Tanusree, Biswas, G P, Das, Debesh K |
| المصدر: | 2020 IEEE 29th Asian Test Symposium (ATS) Asian Test Symposium (ATS), 2020 IEEE 29th. :1-6 Nov, 2020 |
| Relation: | 2020 IEEE 29th Asian Test Symposium (ATS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728174679 |
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| تدمد: | 23775386 |
| DOI: | 10.1109/ATS49688.2020.9301580 |