دورية أكاديمية
Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging
| العنوان: | Laser-Assisted Sintering of Silver Nanoparticle Paste for Bonding of Silicon to DBC for High-Temperature Electronics Packaging |
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| المؤلفون: | Liu, G.D., Wang, C., Swingler, J. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(3):522-529 Mar, 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2020.3046917 |