مؤتمر
Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect
| العنوان: | Laser drilling and Plasma Cleaning Process for Blind Via Through Mold Interconnect |
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| المؤلفون: | Hsiao, Hsiang-Yao, Wee Ho, David Soon, Sing Lim, Keith Cheng, Chong, Ser Choong, Chai, Tai Chong, Schutzberger, David, Oz, Yariv, Amrani, Guy, Zhao, Jack, Toh, Johnson |
| المصدر: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :14-18 Dec, 2020 |
| Relation: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728189116 9781728189109 |
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| DOI: | 10.1109/EPTC50525.2020.9315051 |