مؤتمر
Investigation of Shear Strength and Temperature Cycling Performance of Bi-doped Sn-Ag-Cu Solder Joints
| العنوان: | Investigation of Shear Strength and Temperature Cycling Performance of Bi-doped Sn-Ag-Cu Solder Joints |
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| المؤلفون: | Zou, Y. S., Chung, M. H., Tennant, Tracy, Gan, C. L., Hsu, Yun Ting, Takiar, Hem |
| المصدر: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :286-290 Dec, 2020 |
| Relation: | 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781728189116 9781728189109 |
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| DOI: | 10.1109/EPTC50525.2020.9315072 |