Fabrication of vertical through-holes to realize high throughput cell counting

التفاصيل البيبلوغرافية
العنوان: Fabrication of vertical through-holes to realize high throughput cell counting
المؤلفون: Chen, Yu, Chen, Ming-Yuan
المصدر: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2020 IEEE 22nd. :189-193 Dec, 2020
Relation: 2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781728189116
9781728189109
DOI:10.1109/EPTC50525.2020.9315101