Recessed trench MOSFET process without critical alignments makes very high densities possible

التفاصيل البيبلوغرافية
العنوان: Recessed trench MOSFET process without critical alignments makes very high densities possible
المؤلفون: Finney, A., Evans, J., Blair, P., Earnshaw, J., Jerred, P., Lowe, K., Mottram, D., Wolstenholme, N., Wood, A.
المصدر: Proceedings of the 13th International Symposium on Power Semiconductor Devices & ICs. IPSD '01 (IEEE Cat. No.01CH37216) Power semiconductor devices and ICs Power Semiconductor Devices and ICs, 2001. ISPSD '01. Proceedings of the 13th International Symposium on. :283-286 2001
Relation: Proceedings of the 13th International Symposium on Power Semiconductor Devices & ICs. IPSD '01
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:4886860567
9784886860569
تدمد:10636854
DOI:10.1109/ISPSD.2001.934610