التفاصيل البيبلوغرافية
| العنوان: |
Wafer-Scale Encapsulated Saw Temperature and Pressure Sensors for Harsh Environments |
| المؤلفون: |
Ng, Eldwin J., Sharma, Jaibir, Ching, Eva Wai Leong, Wu, Guoqiang, Pohl, Didier, Vancauwenberghe, Olivier |
| المصدر: |
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) Micro Electro Mechanical Systems (MEMS), 2021 IEEE 34th International Conference on. :370-373 Jan, 2021 |
| Relation: |
2021 IEEE 34th International Conference on Micro Electro Mechanical Systems (MEMS) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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