مؤتمر
Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects
| العنوان: | Strategy to Characterize Electromigration Short Length Effects in Cu/low-k Interconnects |
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| المؤلفون: | Zhang, Z., Kraatz, M., Hauschildt, M., Choi, S., Clausner, A., Zschech, E., Gall, M. |
| المصدر: | 2021 IEEE International Reliability Physics Symposium (IRPS) Reliability Physics Symposium (IRPS), 2021 IEEE International. :1-5 Mar, 2021 |
| Relation: | 2021 IEEE International Reliability Physics Symposium (IRPS) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781728168937 |
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| تدمد: | 19381891 |
| DOI: | 10.1109/IRPS46558.2021.9405161 |