دورية أكاديمية
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration
| العنوان: | Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration |
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| المؤلفون: | Jangam, S., Iyer, S.S. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(5):727-738 May, 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2021.3075219 |