مؤتمر
Characterization of Cu extrusion failure mode in dual-damascene Cu/low-k interconnects under electromigration reliability test
| العنوان: | Characterization of Cu extrusion failure mode in dual-damascene Cu/low-k interconnects under electromigration reliability test |
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| المؤلفون: | Jeung-Woo Kim, Won-Sang Song, Sam-Young Kim, Hyan-Soo Kim, Hyun-Goo Jeon, Chae-Bog Lim |
| المصدر: | Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548) Physical and failure analysis of integrated circuits Physical and Failure Analysis of Integrated Circuits, 2001. IPFA 2001. Proceedings of the 2001 8th International Symposium on the. :174-177 2001 |
| Relation: | Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 0780366751 9780780366756 |
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| DOI: | 10.1109/IPFA.2001.941480 |