دورية أكاديمية
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping
| العنوان: | Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping |
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| المؤلفون: | Chen, Z., Yu, D., Zhang, M., Jiang, F. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 11(7):1047-1054 Jul, 2021 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2021.3091998 |