التفاصيل البيبلوغرافية
| العنوان: |
Polyimide (PI) Flexible Hollow Microneedle Array Prepared Based on Optimized Dual-Moulding Processes |
| المؤلفون: |
Ren, Yingjie, Li, Junshi, Wang, Zhongyan, Li, Tingyu, Huang, Dong, Li, Zhihong |
| المصدر: |
2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) SSolid-State Sensors, Actuators and Microsystems (Transducers), 2021 21st International Conference on. :1452-1455 Jun, 2021 |
| Relation: |
2021 21st International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
