التفاصيل البيبلوغرافية
| العنوان: |
A Novel Bi-Free Low Temperature Solder Paste with Outstanding Drop-Shock Resistance |
| المؤلفون: |
Zhang, Hongwen, Lytwynec, Samuel, Wang, Huaguang, Geng, Jie, Mutuku, Francis, Lee, Ning-Cheng |
| المصدر: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) ECTC Electronic Components and Technology Conference (ECTC), 2021 IEEE 71st. :643-653 Jun, 2021 |
| Relation: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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