دورية أكاديمية
Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation
| العنوان: | Electrical and Morphological Characterizations of 3-D Interconnections for Quantum Computation |
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| المؤلفون: | Thomas, C., Charbonnier, J., Garnier, A., Bresson, N., Bouchu, D., Moreau, S., Gustavo, F., Vinet, M. |
| المصدر: | IEEE Transactions on Components, Packaging and Manufacturing Technology IEEE Trans. Compon., Packag. Manufact. Technol. Components, Packaging and Manufacturing Technology, IEEE Transactions on. 12(3):462-468 Mar, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 21563950 21563985 |
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| DOI: | 10.1109/TCPMT.2021.3104326 |