مؤتمر
Analysis of the influence of voids in solder layer on IGBT failure based on ANSYS
| العنوان: | Analysis of the influence of voids in solder layer on IGBT failure based on ANSYS |
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| المؤلفون: | Yang, Guangzhi, Liu, Dong, Li, Zhenwei, Wang, Wei, Wang, Tao, Heng, Xidan |
| المصدر: | 2021 IEEE 16th Conference on Industrial Electronics and Applications (ICIEA) Industrial Electronics and Applications (ICIEA), 2021 IEEE 16th Conference on. :768-773 Aug, 2021 |
| Relation: | 2021 IEEE 16th Conference on Industrial Electronics and Applications (ICIEA) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | ردمك: | 9781665422482 9781665422475 |
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| تدمد: | 21582297 |
| DOI: | 10.1109/ICIEA51954.2021.9516102 |