التفاصيل البيبلوغرافية
| العنوان: |
Exploring W-Cu hybrid dual damascene metallization for future nodes |
| المؤلفون: |
van der Veen, Marleen H., Pedreira, O. Varela, Heylen, N., Jourdan, N., Lariviere, S., Park, S., Struyf, H., Tokei, Zs., Lei, W., Pethe, S., Hwang, S., Chen, F., Wu, Z., Machillot, J., Cockburn, A., Jansen, A. |
| المصدر: |
2021 IEEE International Interconnect Technology Conference (IITC) Interconnect Technology Conference (IITC), 2021 IEEE International. :1-3 Jul, 2021 |
| Relation: |
2021 IEEE International Interconnect Technology Conference (IITC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
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