Virtual metrology for semiconductor manufacturing: Focus on transfer learning

التفاصيل البيبلوغرافية
العنوان: Virtual metrology for semiconductor manufacturing: Focus on transfer learning
المؤلفون: Clain, Rebecca, Borodin, Valeria, Juge, Michel, Roussy, Agnes
المصدر: 2021 IEEE 17th International Conference on Automation Science and Engineering (CASE) Automation Science and Engineering (CASE), 2021 IEEE 17th International Conference on. :1621-1626 Aug, 2021
Relation: 2021 IEEE 17th International Conference on Automation Science and Engineering (CASE)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665418737
9781665418720
تدمد:21618089
DOI:10.1109/CASE49439.2021.9551567