التفاصيل البيبلوغرافية
| العنوان: |
Research on the Reliability of Board Level Interconnect Solder Joints under Thermal-Mechanical Coupling |
| المؤلفون: |
Liu, Xin, Yu, Yongjian, Xie, Weikun, Zhang, Kaihong, Zhu, Kai |
| المصدر: |
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021 |
| Relation: |
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
