مؤتمر
Study on thermal stability of all copper interconnect structures under thermal shock
| العنوان: | Study on thermal stability of all copper interconnect structures under thermal shock |
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| المؤلفون: | Li, Hao, Shen, Jun, Xie, Jiacheng |
| المصدر: | 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021 |
| Relation: | 2021 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665413916 |
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| DOI: | 10.1109/ICEPT52650.2021.9568106 |