التفاصيل البيبلوغرافية
| العنوان: |
Influences of the Solder Size on Growth of Interfacial CU6Sn5 and Mechanical Performance of Sn-3.0Ag-0.5Cu/(111)Cu Joints Subjected to Multiple Reflow Soldering |
| المؤلفون: |
Chen, Ming-Qiang, Zhou, Min-Bo, Li, Yun-Wei, Zhang, Xin-Ping |
| المصدر: |
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) Electronic Packaging Technology (ICEPT), 2021 22nd International Conference on. :1-5 Sep, 2021 |
| Relation: |
2021 22nd International Conference on Electronic Packaging Technology (ICEPT) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
