التفاصيل البيبلوغرافية
العنوان: |
Hardware In The Loop Simulation of the Smart Grid with the inclusion of IEC61850 Communication Protocol |
المؤلفون: |
Palahalli, H., Hemmati, M., Ragaini, E., Gruosso, G. |
المصدر: |
IECON 2021 – 47th Annual Conference of the IEEE Industrial Electronics Society Industrial Electronics Society (IECON), 2021 47th Annual Conference of the IEEE. :1-6 Oct, 2021 |
Relation: |
IECON 2021 - 47th Annual Conference of the IEEE Industrial Electronics Society |
قاعدة البيانات: |
IEEE Xplore Digital Library |