التفاصيل البيبلوغرافية
| العنوان: |
Delamination Analysis of Stacked Via in High-Density Multilayer Printed Wiring Boards by FEA |
| المؤلفون: |
Nozaki, M., Kariya, Y., Hiroshima, Y., Taketomi, N., Ohashi, K., Tomioka, K., Kikuchi, S., Tan, J. |
| المصدر: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :42-42 Oct, 2021 |
| Relation: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
