التفاصيل البيبلوغرافية
| العنوان: |
GaN-HEMTs on Diamond Prepared by Room-Temperature Bonding Technology |
| المؤلفون: |
Hiza, S., Shirayanagi, Y., Takiguchi, Y., Nishimura, K., Matsumae, T., Kurashima, Y., Higurashi, E., Takagi, H., Chayahara, A., Mokuno, Y., Yamada, H., Kasamura, K., Toyoda, H., Kubota, A., Yamamuka, M. |
| المصدر: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) Low Temperature Bonding for 3D Integration (LTB-3D), 2021 7th International Workshop on. :16-16 Oct, 2021 |
| Relation: |
2021 7th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
