التفاصيل البيبلوغرافية
| العنوان: |
110GHz Through-Silicon Via’s Integrated in Silicon Photonics Interposers for Next-Generation Optical Modules |
| المؤلفون: |
Miyaguchi, Kenichi, Ban, Yoojin, Pantano, Nicolas, Sun, Xiao, Absil, Philippe, Bogaerts, Lieve, Verheyen, Peter, Velenis, Dimitrios, Pantouvaki, Marianna, Campenhout, Joris Van |
| المصدر: |
2021 European Conference on Optical Communication (ECOC) Optical Communication (ECOC), 2021 European Conference on. :1-4 Sep, 2021 |
| Relation: |
2021 European Conference on Optical Communication (ECOC) |
| قاعدة البيانات: |
IEEE Xplore Digital Library |
