مؤتمر
Influence of Al/CucorAl wire bonding on reliability of SiC devices
| العنوان: | Influence of Al/CucorAl wire bonding on reliability of SiC devices |
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| المؤلفون: | Fang, Chao, Tang, Xiang, Qin, Guangyuan, Ke, Haotao, Wu, Yibo, Zhang, Jing, Chang, Guiqin, Luo, Haihui |
| المصدر: | 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia), 2021 IEEE Workshop on. :259-263 Aug, 2021 |
| Relation: | 2021 IEEE Workshop on Wide Bandgap Power Devices and Applications in Asia (WiPDA Asia) |
| قاعدة البيانات: | IEEE Xplore Digital Library |
| ردمك: | 9781665418515 9781665418508 |
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| DOI: | 10.1109/WiPDAAsia51810.2021.9655999 |