دورية أكاديمية
Virtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Plasma
| العنوان: | Virtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Plasma |
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| المؤلفون: | Choi, J.E., Park, H., Lee, Y., Hong, S.J. |
| المصدر: | IEEE Transactions on Semiconductor Manufacturing IEEE Trans. Semicond. Manufact. Semiconductor Manufacturing, IEEE Transactions on. 35(1):128-136 Feb, 2022 |
| قاعدة البيانات: | IEEE Xplore Digital Library |
Full Text Finder | تدمد: | 08946507 15582345 |
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| DOI: | 10.1109/TSM.2021.3138918 |