التفاصيل البيبلوغرافية
العنوان: |
Systematic Investigation and Characterization of Ag Paste for LED Die Attach |
المؤلفون: |
Hu, Liangxing, Tao, Jing, Bao, Shuyu, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng |
المصدر: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :140-143 Dec, 2021 |
Relation: |
2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) |
قاعدة البيانات: |
IEEE Xplore Digital Library |