Systematic Investigation and Characterization of Ag Paste for LED Die Attach

التفاصيل البيبلوغرافية
العنوان: Systematic Investigation and Characterization of Ag Paste for LED Die Attach
المؤلفون: Hu, Liangxing, Tao, Jing, Bao, Shuyu, Goh, Simon Chun Kiat, Lim, Yu Dian, Zhao, Peng, Lim, Michael Joo Zhong, Tan, Sai Choo, Chew, Kai Hwa, Tan, Chuan Seng
المصدر: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC) Electronics Packaging Technology Conference (EPTC), 2021 IEEE 23rd. :140-143 Dec, 2021
Relation: 2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC)
قاعدة البيانات: IEEE Xplore Digital Library
الوصف
ردمك:9781665416191
DOI:10.1109/EPTC53413.2021.9663936